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HomeDrone NewsNew Qualcomm-Constructed Superior Video Processor by Teledyne FLIR Powers AI on the...

New Qualcomm-Constructed Superior Video Processor by Teledyne FLIR Powers AI on the Edge – sUAS Information – The Enterprise of Drones


New AVP with industry-leading measurement, weight, and energy (SWaP) runs Teledyne FLIR’s Prism AI and ISP software program libraries enabling drone, robotic, and safety digital camera payloads

GOLETA, Calif. – Teledyne FLIR, a part of Teledyne Applied sciences Included, in the present day introduced Teledyne FLIR AVP, a sophisticated video processor designed to energy Teledyne FLIR’s Prism™ AI and computational imaging on the edge.

The AVP incorporates the most recent Qualcomm QCS8550, probably the most superior cell processor chip from the chief in cell, automotive, and robotics system-on-chip (SoC) expertise. The AVP gives best-in-class synthetic intelligence (AI) efficiency inside a small, light-weight, and low-power module for thermal and visual digital camera integration into unmanned aerial autos, robots, small gimbals, handheld units, and fixed-mounted safety techniques.

AVP runs the Teledyne FLIR Prism AI and ISP software program libraries and interfaces with the Boson® and Neutrino® thermal infrared imaging digital camera modules and a variety of common seen cameras. Skilled on the world’s largest thermal picture knowledge lake of greater than 5 million annotations, Prism AI is a strong notion software program designed to detect, classify, and observe targets or objects for automotive autonomy, automotive computerized emergency braking, airborne digital camera payloads, counter-drone techniques, floor intelligence, surveillance and reconnaissance (ISR), and perimeter safety. Prism ISP is a complete set of picture processing algorithms that embody tremendous decision, picture fusion, atmospheric turbulence elimination, digital stabilization, local-contrast enhancement, and noise discount.

“The brand new AVP is probably the most highly effective and SWaP-optimized processor available on the market in the present day, working AI workloads as much as 5 instances sooner than aggressive choices,” stated Dan Walker, vp of product administration, Teledyne FLIR. “The mix of highly effective edge computing and our Prism digital options ushers in a brand new period of electro-optical system capabilities whereas simplifying growth and lowering integration danger.”

The AVP is designed to empower integrators to construct highly effective, edge-intelligent merchandise. It’s supported by a number of instruments to simplify and streamline growth together with a Qualcomm RB5 growth package. Software program and board-support packages are additionally accessible to allow builders to design and fabricate customized interface boards that meet every product’s particular type, match, operate, and input-output (IO) necessities.

For extra details about the Teledyne FLIR AVP, please go to www.flir.com/avp. To see the brand new AVP at SPIE Protection + Industrial Sensing Exhibition, go to Teledyne sales space #702, April 23 by way of April 25, 2024.

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